BibTeX record journals/mr/LiDMLWH11

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@article{DBLP:journals/mr/LiDMLWH11,
  author    = {Junhui Li and
               Luhua Deng and
               Bangke Ma and
               Ling gang Liu and
               Fuliang Wang and
               Lei Han},
  title     = {Investigation of the characteristics of overhang bonding for 3-D stacked
               dies in microelectronics packaging},
  journal   = {Microelectronics Reliability},
  volume    = {51},
  number    = {12},
  pages     = {2236--2242},
  year      = {2011},
  url       = {https://doi.org/10.1016/j.microrel.2011.06.005},
  doi       = {10.1016/j.microrel.2011.06.005},
  timestamp = {Sun, 28 May 2017 13:23:37 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/mr/LiDMLWH11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
Schloss Dagstuhl LZI